전기 전도성 접착제(Die Attach & Thermally Conductive Adhesive)
반도체 칩 페키징,광전자 분야에 적용되는 우수한 방열성, 고순도, , 저모듈러스, 스트레스 흡수, 전기비전도성 및 전도성이 있는 칩본딩 접착제임.
  DA-6523 DA-6524 DA-6533
특징(Features) High electrically & thermal-
thermal, Solventless
High electrically & thermal-
ly conductive Adhesive
High electrically & thermal-
ly conductive Adhesive
적용용도(Applications) LSI(QFP,BGA etc),between
TCPof MPU and PC borads
LSI(QFP,BGA etc),between
TCPof MPU and PC borads,
Heat sensitive die, stress-
sensitive, packaging
물 성(Physical properties)      
경화형태(1 or 2 Part Heat Cure Type) 1 Part HC 1 Part HC 1 Part HC
색상( Color: Clear, White, Black, Gray, Red, Blue) G G G
점도(Viscosity/cps) 230 270 450
경도(Durometer, JIS Type A) 85 82 90
비중(Specific Gravity, 25℃) 3.60 3.70 4.50
작업가능시간(Working Time RT, min/℃) NA NA NA
경화시간(Cure Time, hr/℃) 1~3min@150~180℃ 1hr@150℃ 1hr@150℃
영모듈러스(Young's Modules, Mpa) 19.60 12.00 20.00
나트륨 이온함량(Na Content, ppm) 1.00 < 2 < 2
칼륨 이온함량(K Content, ppm) 1.00 < 2 < 2
염소 이온함량(Cl Content, ppm) NA < 2 < 2
체적저항율(Volume Resistivity, ohm-cm) 0.0003 0.0003 0.0002
열전도도( Thermal Conductivity, W/m?K) 2.10 2.10 4.40
선형열팽창계수(CTE, cm/cc-℃,ppm) NA 200 200
신율(Elongation, %) 30 80 75
인장강도(Tensile Strength, MPa) 5.90 2.50 2.50
접착강도(Adhesion Lap Shear, psi)      
① Aluminum N/㎠ 230 130 120
② Glass N/㎠ NA 170 120
③ Ni N/㎠ NA NA 120
수분흡수율(72hr/℃+85% R.H., wt%) NA < 0.1 < 0.1
보관(Srorage ,℃) -20 -20 -20