반도체 칩 페키징 고순도 접착제(Chip Scale Packaging)
반도체 칩 페키징,광전자 분야에 적용되는 우수한 전기전도성,방열성, 고순도, , 저모듈러스, 스트레스 흡수, 비전도성 있는 칩본딩 접착제임.
  FA-2028 &
FA-2017
JCR-6172 DC-6910 DC-7910 DC-7920 DA-6501 DA-6502 DA-6503
특징(Features) Precured sheets of a
silicone elastomer
Stencil Printable, Self-
priming silicone elastomer
Stencil Printable, Thixo-
tropic, silicone elastomer
Stencil Printable, White
Solventless, elastomer
Solventless, Dispensible
Self-priming silicone
Solventless, No by-prod-
cts, Stress relief
Solventless, No by-prod-
cts, Stress relief
Solventless, No by-prod-
cts, Stress relief
적용용도(Applications) Die Attach,
Flim adhesive
Die Attach, Lead bonds DRAM-grade purity DRAM-grade DRAM-grade Die Attach, LSI
IC chip
Die Attach, LSI,
IC chip
Die Attach, LSI
IC chip
물 성(Physical properties)                
경화형태(1 or 2 Part Heat Cure Type) Cured film 2 Part RTV or HCA 1 Part HC 1 Part HC 1 Part HC 1 Part HC 1 Part HC 1 Part HC
혼합비(Mixed Ratio, Part A vs Part B) NA 100:100 NA NA NA NA NA NA
색상( Color: Clear, White, Black, Gray, Red, Blue) T T B W B Semi-clear  B Semi-clear 
점도(Viscosity/cps) NA 4,000 85,000 130,000 24,000 75 75 77
경도(Durometer, JIS Type A) 35 38 70 70 71 26 26 33
산농도(PH) NA NA NA NA NA 5.6 5.6 5.6
비중(Specific Gravity, 25℃) 1.00 1.00 1.10 1.10 1.20 1.00 1.00 1.00
작업가능시간(Working Time RT, min/℃) NA 〉24 〉8 〉8 〉24 10 days 10 days 10 days
경화시간(Cure Time, hr/℃) NA 1hr@150℃ 0.5hr@150℃ 0.5hr@150℃ 0.5hr@150℃ 1~3min@150℃ 1~3min@150℃ 1~3min@150℃
영모듈러스(Youngs Modules, Mpa) 1.00 1.10 5.00 5.00 5.50 0.9 0.9 1.1
선형열팽창계수(CTE, cm/cc-℃) 330 330 285 295 240 -0.0003 cm/cm,℃ -0.0003 cm/cm,℃ -0.0003 cm/cm,℃
절연파괴강도(Dielectric Strength, kv/mm) 20 20 18.80 18.10 19.60 25 25 26
유전상수(Dielectric Constant at 0.1MHz or 1MHz) 3.0@1 MHz 2.8@1 MHz 2.95@100kHz 2.73@100kHz 2.81@100kHz 2.7@1 MHz 2.7@1 MHz 2.7@1 MHz
체적저항율(Volume Resistivity, ohm-cm) 1.00 x 1015 1.00 x 1015 1.85 x 1015 1.30 x 1015 2.10 x 1015 1.0 x 1016 1.0 x 1016 1.0 x 1016
유전정접(Dissipation Factor at 0.1MHz or 1MHz) 0.001@1 MHz 0.001@1 MHz 0.0002@100kHz 0.0002@100kHz 0.0002@100kHz 0.0006@1 MHz 0.0006@1 MHz 0.0006@1 MHz
나트륨 이온함량(Na Content, ppm) NA NA NA NA NA 0.1 0.1 0.1
칼륨 이온함량(K Content, ppm) NA NA NA NA NA 0.2 0.2 0.2
염소 이온함량(Cl Content, ppm) NA NA NA NA NA 0.5 0.5 0.5
유리전이온도(Tg℃) NA NA NA NA NA -120 -120 -120
전기전도도(㎲?㎝) NA NA NA NA NA 5.00 5.00 4.00
신율(Elongation, %) NA NA NA NA NA 240 240 220
인장강도(Tensile Strength, psi ) NA NA NA NA NA 0.9MPa 0.9MPa 2.2MPa
접착강도(Adhesion Lap Shear, psi) 290 250 NA NA 1,000      
① Aluminum N/㎠           58.0000 57 64.0000
② Glass N/㎠           58 57 64
③ Cupper N/㎠           58 57 64