반도체 칩 페키징 고순도 코팅제(Chip Protective Coating)
반도체 칩,광전자 산업분야의 칩 페키징용으로 우수한 접착력,고순도,내습성, 내습성 및 전기적 안정성을 가진 보호 코팅 및 몰딩용의 실리콘임.
  JCR-6101 DC-6102 Q3-6633 JCR-6101UP JCR-6160 JCR-6109 JCR-6146 Q3-6646A&B
특징(Features) Semiconductor Protective
Coating
Semiconductor Protective
Coating
Optical Die Coating Semiconductor Protective
Coating, Thixotropic

Semiconductor Protective
Coating

Semiconductor Protective
Coating

Glob Top for COB Optical Die Coating
적용용도(Applications) LED DIP Photo Coupler, LED LED Power Amplifier IC Coating Photo Coupler Optical Network Unit Photo Coupler, LED
물 성(Physical properties)                
경화형태(1 or 2 Part Heat Cure Type) 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 2 Part Heat Cure
혼합비(Mixed Ratio, Part A vs Part B) NA NA NA NA NA NA NA 100:100
색상( Color: Clear, White, Black, Gray, Red, Blue) C B C T T T B C
점도(Viscosity/cps) 6,200 4,700 2,800 20,000 6,300 3,900 15,000 700
경도(Durometer, JIS Type A) 28 27 34 36 25 NA 80 NA
침입도(Penetration, mm) NA NA NA NA NA 167 1/10mm NA 55 1/10mm
비중(Specific Gravity, 25℃) 1.03 1.02 1.06 1.04 1.01 1.04 1.28 0.97
작업가능시간(Working Time RT, min/℃) NA NA NA NA NA NA NA 16
경화시간(Cure Time, hr/℃) 4hr@70℃+2hr@150℃ NA NA 1hr@70℃+2hr@150℃ 1hr@150℃ 1hr@70℃+16hr@150℃ 1hr@150℃ 1hr@150℃
영모듈러스(Youngs Modules, Mpa) 1.30 1.00 3.40 1.20 0.69 NA 9.80 Varies
선형열팽창계수(CTE, cm/cc-℃) NA 315 NA 300 320 NA 220 NA
절연파괴강도(Dielectric Strength, kv/mm) 18.70 20.30 13.80 25.00 19.00 18.00 34.00 22.60
유전상수(Dielectric Constant at 0.1MHz or 1MHz) 2.8@0.1MHz 2.8@0.1MHz 2.6@0.1MHz NA NA 2.8@1MHz NA 2.9@0.1MHz
체적저항율(Volume Resistivity, ohm-cm) 1.40 x 1013 1.50 x 1013 3.00 x 1013 2.90 x 1013 4.90 x 1013 1.80 x 1013 2.50 x 1013 3.70 x 1013
유전정접(Dissipation Factor at 0.1MHz or 1MHz) 0.0002@0.1MHz 0.0002@0.1MHz 0.0001@0.1MHz NA NA 0.0005@1MHz NA 0.0001@0.1MHz
나트륨 이온함량(Na Content, ppm) < 2 < 2 < 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 < 2
칼륨 이온함량(K Content, ppm) NA NA NA ≤ 2 ≤ 2 ≤ 2 ≤ 2 NA
염소 이온함량(Cl Content, ppm) < 10 < 10 < 5 NA NA ≤ 10 ≤ 30 < 5
우라늄 이온함량(U Content, ppm) NA NA NA NA NA NA NA NA
토륨 이온함량(Th Content, ppm) NA NA NA NA NA NA NA NA
접착강도(Adhesion Lap Shear, MPa) NA NA 0.5 NA 0.31 NA 2.90 NA
인장강도(Tensile Strength, psi ) 260 264 290 NA NA NA NA NA
신율(Elongation, %) 240 245 255 170 NA NA 70 NA
굴절율(Refractive Index) 1.407 NA 1.447 NA NA NA NA 1.403
 
반도체 칩 페키징 고순도 코팅제(Chip Protective Coating)
반도체 칩 페키징,광전자 분야에 적용되는 우수한 접착력, 고순도, 내열성, 내한성, 저모듈러스, 스트레스 흡수, 전기적 안정성을 가진 실리콘으로 보호 코팅과 몰딩용 제품임
  Q1-4939A&B JCR-6121A&B JCR-6122A&B JCR-6125A&B JCR-6126A&B(W/C) JCR-6140A&B JCR-6155A&B JCR-6159A&B
특징(Features) Optical Die Coating Semiconductor Protective
Coating
Semiconductor Protective
Coating
Semiconductor Protective
Coating
Semiconductor Protective
Coating
Semiconductor Protective
Coating
Semiconductor Protective
Coating
Semiconductor Protective
Coating
적용용도(Applications) Photo Coupler, LED TPH LED, ASIC, Image Sensor LCD Driver, TPH,
Image Sensor
LED, TPH, Image Sensor CCD, ONU TPH, Image Sensor TPH
물 성(Physical properties)                
경화형태(1 or 2 Part Heat Cure Type) 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure
혼합비(Mixed Ratio, Part A vs Part B) 100:100(Varies) 100:5 100:100 100:100 100:10 100:100 100:10 100:100
색상( Color: Clear, White, Black, Gray, Red, Blue) C T or C T or C T or C T or C  C T or C
점도(Viscosity/cps) 4,900~5,800 2,400 340 9,000 85,000 3,200 2,000 125,000
경도(Durometer, JIS Type A) 28@ 100:100 20 35 23 27 40 26 53
침입도(Penetration, mm) 55 1/10@100:10 NA NA NA NA NA NA NA
비중(Specific Gravity, 25℃) 1.03 0.98 0.97 0.99 1.03 1.00 0.97 1.07
작업가능시간(Working Time RT, min/℃) NA NA NA NA NA NA NA NA
경화시간(Cure Time, hr/℃) 2hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃
영모듈러스(Youngs Modules, Mpa) Varies 0.59 1.10 0.66 0.69 0.98 0.63 2.50
선형열팽창계수(CTE, cm/cc-℃) 270 320 320 310 300 320 320 300
절연파괴강도(Dielectric Strength, kv/mm) 18.50 21.00 23.00 24.00 26.00 31.00 23.00 31.00
유전상수(Dielectric Constant at 0.1MHz or 1MHz) 2.7@0.1MHz 2.7@1MHz 2.7@1MHz 2.6@1MHz 2.8@1MHz 2.8@1MHz 3.0@1MHz 2.9@1MHz
체적저항율(Volume Resistivity, ohm-cm) 1.00 1015 2.00 1015 3.30 1015 2.70 1014 3.50 1014 2.10 1014 2.20 1015 3.30 1015
유전정접(Dissipation Factor at 0.1MHz or 1MHz) 0.0002@0.1MHz 0.0004@1MHz 0.0004@1MHz 0.0008@1MHz 0.0006@1MHz 0.0009@1MHz 0.0003@1MHz 0.0008@1MHz
나트륨 이온함량(Na Content, ppm) < 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2
칼륨 이온함량(K Content, ppm) < 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2
염소 이온함량(Cl Content, ppm) < 4 NA ≤ 10 ≤ 10 ≤ 10 NA NA NA
우라늄 이온함량(U Content, ppm) NA NA NA NA NA NA NA NA
토륨 이온함량(Th Content, ppm) NA NA NA NA NA NA NA NA
접착강도(Adhesion Lap Shear, MPa) NA 0.22 NA 0.39 0.95 1.4 NA NA
인장강도(Tensile Strength, psi ) 1,000 NA NA NA NA NA NA NA
신율(Elongation, %) 115 160 NA 230 290 175 180 NA
굴절율(Refractive Index) 1.409 NA NA NA NA NA NA NA
 
반도체 칩 페키징 고순도 코팅제(Chip Protective Coating)
반도체 칩 페키징,광전자 분야에 적용되는 우수한 접착력, 고순도, 내열성, 내한성, 저모듈러스, 스트레스 흡수, 전기적 안정성을 가진 실리콘으로 보호 코팅과 몰딩용 제품임
  JCR-6110A&B JCR-6224 JCR-6168 DC-6210 DC-6810 DC-6811 DC-6812 DC-6820
특징(Features) Semiconductor Protective
Coating
DRAM-grade Encapsulant DRAM-grade Encapsulant DRAM-grade Encapsulant Mircoelectronics-grade
Encapsulant
DRAM-grade Encapsulant DRAM-grade Encapsulant DRAM-grade Encapsulant
적용용도(Applications)                
물 성(Physical properties)                
경화형태(1 or 2 Part Heat Cure Type) 2 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure 1 Part Heat Cure
혼합비(Mixed Ratio, Part A vs Part B) 100:10 NA NA NA NA NA NA NA
색상( Color: Clear, White, Black, Gray, Red, Blue) C B B B B B B B
점도(Viscosity/cps) 2,100 2,500 10,000 10,000 73,000 34,000 30,500 30,500
경도(Durometer, JIS Type A) NA 55 63 60 60 63 65 65
침입도(Penetration, mm) 225 1/10mm NA NA NA NA NA NA NA
비중(Specific Gravity, 25℃) 1 1.42 1.2 1.2 1.32 1.25 1.39 1.39
작업가능시간(Working Time RT, min/℃) NA NA 〉24 24 6 24 48 48
경화시간(Cure Time, hr/℃) 1hr@150℃ 1hr@150℃ 1hr@150℃ 1hr@150℃ 0.5hr@150℃ 1hr@150℃ 0.5hr@150℃ 0.5hr@150℃
영모듈러스(Youngs Modules, Mpa) NA 3.00 3.40 3.50 2.80 2.70 2.60 2.60
선형열팽창계수(CTE, cm/cc-℃) NA 180 230 230 270 250 207 207
절연파괴강도(Dielectric Strength, kv/mm) 15.00 27.00 20.00 20.00 14.20 19.70 19.60 19.60
유전상수(Dielectric Constant at 0.1MHz or 1MHz) 2.8@0.1MHz 3.1@0.1MHz 3.1@0.1MHz 3.0@1MHz 3.1@0.1MHz 2.8@0.1MHz 2.9@0.1MHz 2.9@0.1MHz
체적저항율(Volume Resistivity, ohm-cm) 4.00 x 1014 1.30 x 1016 1.00 x 1015 1.00 x 1015 9.70 x 1014 2.00 x 1015 1.80 x 1015 1.80 x 1015
유전정접(Dissipation Factor at 0.1MHz or 1MHz) 0.0006@1MHz 0.0010@1MHz 0.001@1MHz 0.001@1MHz 0.002@0.1MHz 0.0002@0.1MHz 0.0002@0.1MHz 0.0002@0.1MHz
나트륨 이온함량(Na Content, ppm) ≤ 1 ≤ 2 NA < 2 < 5 < 2 < 1 < 1
칼륨 이온함량(K Content, ppm) ≤ 1 ≤ 2 NA < 2 < 5 < 2 < 1 < 1
염소 이온함량(Cl Content, ppm) ≤ 2 ≤ 10 NA < 2 < 10 < 5 < 2 < 2
우라늄 이온함량(U Content, ppm) NA ≤ 1 NA NA NA NA NA NA
토륨 이온함량(Th Content, ppm) NA ≤ 1 NA NA NA NA NA NA
접착강도(Adhesion Lap Shear, MPa) NA 1.7 213 psi 2.00 6.30 5.50 3.90 NA
인장강도(Tensile Strength, psi ) NA NA NA NA NA NA NA NA
신율(Elongation, %) NA NA NA NA NA NA NA NA
굴절율(Refractive Index) NA NA NA NA NA NA NA NA
 
 
반도체 칩 페키징,광전자 분야에 적용되는 우수한 접착력, 고순도, 내열성, 내한성, 저모듈러스, 스트레스 흡수, 전기적 안정성을 가진 실리콘으로 보호 코팅과 몰딩용 제품임
  EG-6301A&B OE-6336A&B JCR-6175A&B SR-7010A&B
특징(Features) Hard Modulus, High trans-
parency, High Elastomer
Lower-viscosity of
EG-6301A&B
High refractive index,
High transparency
High refractive index,
Hard-resin
적용용도(Applications) Power LED Module Encapsulants Power LED Module Encapsulants Power LED Module Encapsulants Clear LED resin for
favricated parts
물 성(Physical properties)        
경화형태(1 or 2 Part Heat Cure Type) 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure 2 Part Heat Cure
혼합비(Mixed Ratio, Part A vs Part B) 100:100 100:100 100:100 100:100
색상( Color: Translucent, Clear, Black,White) C B B B
점도(Viscosity/cps) 2,900/4,100(A/B) 950/2,100(A/B) 11,000/3000(A/B) 20,000/7000(A/B)
경도(Durometer, JIS Type A or D) 71A 65A 31A 67D
침입도(Penetration, mm) NA NA NA NA
비중(Specific Gravity, 25℃) 1 1.42 1.2 1.2
작업가능시간(Working Time RT, hr/25℃) 〉120hr@25℃ NA 〉300hr@25℃ 〉3hr@25℃
경화시간(Cure Time, hr/℃) 1hr@150℃ 1hr@150℃ 1hr@150℃ 1min@150℃
영모듈러스(Youngs Modules, MPa) NA NA NA NA
선형열팽창계수(CTE, cm/cc-℃) 270 NA 222 200
광굴절율(Refractive Index)        
① Cured @ 633nm 1.411 1.413 1.539 1.532
② Cured @ 1,231nm 1.403 1.404 1.524 1.516
③ Cured @ 1,554nm 1.402 1.402 1.522 1.514
광투과율(% Transmittance)        
①@ 450nm 97(1mm  thickness) 98(1mm  thickness) 99(1mm  thickness) 99(1.8mm  thickness)
②@ 800nm 95(3.1mm  thickness) 98(3.1mm  thickness) 100(1cm  thickness) 100(1.8mm  thickness)
유리전이온도(Tg℃) -124 NA -28 NA
나트륨 이온함량(Na Content, ppm) 0.1 NA 0.2 < 1
칼륨 이온함량(K Content, ppm) 0.2 NA 0.30 < 1
염소 이온함량(Cl Content, ppm) 1 NA 1 < 1
신율(Elongation, %) 80 NA 40 NA